Fifth Generation HEXFETs from INFINEON utilize advanced processing techniques to achieve the lowest possible on-resistance per silicon area.
The benefit of the lowest possible on-resistance, combined with the fast switching speed and ruggedized device design, provides the designer with an extremely efficient device for use in a wide variety of applications. The D-PAK is designed for surface mounting using vapor phase, infrared, or wave soldering techniques. Power dissipation levels up to 1.5 watts are possible in typical surface mount applications.
Please find a selection of the fifth generation HEXFETs below
For the full overview please visit our website
Make sure you use the original parts and check the marking.
Note: For the most current drawing please refer to Infineon's website: www.infineon.com
For more and detailed information, please contact our sales-desk.
